Title:
HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/168603
Kind Code:
A1
Abstract:
The present invention comprises a first amplifier circuit (110), a second amplifier circuit (210), a first matching circuit (120) connected to the first amplifier circuit (110), and a second matching circuit (220) connected to the second amplifier circuit (210). The first matching circuit (120) and the second matching circuit (220) are disposed adjacent to each other so that the harmonic waves of signals transmitted through the the first matching circuit (120) will be attenuated. The first matching circuit (120) may be provided on the output side of the first amplifier circuit (110).
Inventors:
HONDA AKIFUMI (JP)
Application Number:
PCT/JP2018/008746
Publication Date:
September 20, 2018
Filing Date:
March 07, 2018
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H04B1/50; H03H7/38
Domestic Patent References:
| WO2017006866A1 | 2017-01-12 | |||
| WO2013118664A1 | 2013-08-15 | |||
| WO2016181701A1 | 2016-11-17 | |||
| WO2016136413A1 | 2016-09-01 |
Foreign References:
| JP2014138381A | 2014-07-28 | |||
| JP2015510359A | 2015-04-02 |
Attorney, Agent or Firm:
YOSHIKAWA, Shuichi et al. (JP)
Download PDF: