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Title:
HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/179541
Kind Code:
A1
Abstract:
This high-frequency module (1) comprises: a mounting substrate (90); a duplexer (60L) positioned on the mounting substrate (90); a duplexer (60H) having a passband with a higher frequency than the passband of the duplexer (60L) and positioned on the mounting substrate (90); and a semiconductor control IC (40) laminated to the duplexer (60L) from among the duplexers (60L and 60H), and positioned on the mounting substrate (90).

Inventors:
MURASE HISANORI (JP)
Application Number:
PCT/JP2020/007439
Publication Date:
September 10, 2020
Filing Date:
February 25, 2020
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H03H7/075; H03H7/38; H03H7/46; H04B1/38
Domestic Patent References:
WO2018110513A12018-06-21
WO2017033564A12017-03-02
Foreign References:
JP2005123909A2005-05-12
JP2017184060A2017-10-05
Attorney, Agent or Firm:
YOSHIKAWA, Shuichi et al. (JP)
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