Title:
HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/202891
Kind Code:
A1
Abstract:
The purpose of the present invention is to achieve space saving and cost reduction. A high-frequency module (1) is provided with a band-pass filter (2), a first low noise amplifier (4), a second low noise amplifier (5), and an attenuation filter (6). The band-pass filter (2) has an output terminal (21), and allows a first reception signal and a second reception signal to pass therethrough. The first low noise amplifier (4) is connected to the output terminal (21) of the band-pass filter (2), and amplifies the first reception signal. The second low noise amplifier (5) is connected to the output terminal (21) of the band-pass filter (2), and amplifies the second reception signal. The attenuation filter (6) is provided on a common path (17) between the output terminal (21) of the band-pass filter (2) and the first low noise amplifier (4) and between the output terminal (21) of the band-pass filter (2) and the second low noise amplifier (5).
Inventors:
TAKAYANAGI SHINICHIRO
Application Number:
PCT/JP2020/007140
Publication Date:
October 08, 2020
Filing Date:
February 21, 2020
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H03H7/075; H04B1/00; H04B1/18; H04B1/40
Domestic Patent References:
| WO2019059085A1 | 2019-03-28 | |||
| WO2019166863A1 | 2019-09-06 | |||
| WO2019176538A1 | 2019-09-19 |
Foreign References:
| US20170070243A1 | 2017-03-09 | |||
| JP2016501467A | 2016-01-18 |
Other References:
ERICSSON, 3GPP RELEASE 16, 31 July 2019 (2019-07-31), pages 1 - 7, XP009524079
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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