Title:
HIGH-FREQUENCY MODULE, AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/261769
Kind Code:
A1
Abstract:
Provided are a high-frequency module and a communication device with which it is possible to reduce the size of a mounting board. A high-frequency module (1) is provided with a mounting board (3), a first filter (21), and a second filter (22). The mounting board (3) has a first main surface (31) and a second main surface (32) that oppose one another. The first filter (21) allows a first received signal in a first frequency band to pass. The second filter (22) allows a second received signal in a second frequency band different from the first frequency band to pass. The first filter (21) is provided on the first main surface (31). The second filter (22) is stacked on the first filter (21).
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Inventors:
YAMAGUCHI YUKIYA
Application Number:
PCT/JP2020/018547
Publication Date:
December 30, 2020
Filing Date:
May 07, 2020
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H04B1/00; H04B1/16; H04B1/38
Domestic Patent References:
| WO2019065311A1 | 2019-04-04 | |||
| WO2012036134A1 | 2012-03-22 |
Foreign References:
| JP2005079885A | 2005-03-24 |
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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