Title:
HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/262028
Kind Code:
A1
Abstract:
Provided are a high-frequency module and a communication device that can be downsized and enable prevention of reduction in isolation at the time of execution of carrier aggregation. A high-frequency module (1) can simultaneously communicate a signal in a first communication band and a signal in a second communication band but does not simultaneously communicate the signal in the first communication band and a signal in a third communication band. The high-frequency module (1) includes a mounting substrate (3), a filter (21), a filter (24), and a filter (23). The filter (21) is provided above the mounting substrate (3) and uses the first communication band as a passband. The filter (24) is provided above the mounting substrate (3) and uses the second communication band as a passband. The filter (23) is provided above the mounting substrate (3) and uses the third communication band as a passband. The filter (21) and the filter (23) are indirectly stacked, and the filter (21) and the filter (24) are not stacked.
Inventors:
TANAKA RUI
Application Number:
PCT/JP2020/023116
Publication Date:
December 30, 2020
Filing Date:
June 11, 2020
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H04B1/00; H04B1/16; H04B1/38
Foreign References:
| JP2007214566A | 2007-08-23 | |||
| JP2003218150A | 2003-07-31 |
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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