Title:
HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/039076
Kind Code:
A1
Abstract:
A high-frequency module (1) is provided with a module substrate (70) having mutually opposed main surfaces (701 and 702), external connection terminals (90a and 90b) positioned on the main surface (702), a power amplifier (11) having mutually opposed main surfaces (111 and 112) and positioned on the main surface (702) so that the main surface (111) forms a surface for mounting onto the module substrate (70), a bonding wire (45) connected to the main surface (112), and a heat dissipation electrode (91) positioned apart from the power amplifier (11) on the main surface (112) side of the power amplifier (11) and connected to the bonding wire (45).
Inventors:
TSUDA MOTOJI (JP)
YAMAGUCHI YUKIYA (JP)
YAMAGUCHI YUKIYA (JP)
Application Number:
PCT/JP2020/024857
Publication Date:
March 04, 2021
Filing Date:
June 24, 2020
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/34
Domestic Patent References:
| WO2018101384A1 | 2018-06-07 |
Foreign References:
| JP2011040602A | 2011-02-24 |
Attorney, Agent or Firm:
YOSHIKAWA, Shuichi et al. (JP)
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