Title:
HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/251217
Kind Code:
A1
Abstract:
The present invention makes it possible to achieve both low loss and good attenuation characteristics in each of a plurality of communication bands. A high frequency module (1) comprises a plurality of power amplifiers, an external connection terminal (4), a filter (5), and a switch (6). The plurality of power amplifiers include a first power amplifier (2) and a second power amplifier (3). The external connection terminal (4) is connected to a tracker component (85) that supplies a power supply voltage (V1) to the plurality of power amplifiers. The filter (5) is not provided on a first path (P1) between the external connection terminal (4) and the first power amplifier (2) but is provided on a second path (P2) between the external connection terminal (4) and the second power amplifier (3). The switch (6) switches connection to the external connection terminal (4) between the first path (P1) and the second path (P2).
Inventors:
TOMITA NAOHIDE
KOGURE TAKESHI
KOGURE TAKESHI
Application Number:
PCT/JP2021/020863
Publication Date:
December 16, 2021
Filing Date:
June 01, 2021
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H04B1/04; H03F1/02; H03F3/24
Foreign References:
| JP2014502808A | 2014-02-03 | |||
| JP2015533066A | 2015-11-16 | |||
| JP2019083476A | 2019-05-30 |
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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