Title:
HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/092308
Kind Code:
A1
Abstract:
The purpose of the present invention is to suppress deterioration of characteristics of a second filter due to the influence of heat generated in a first filter during simultaneous transmission using both the first filter and the second filter. A high frequency module comprises a mounting substrate (30), a first filter (7A), a second filter (7D), a shield layer (33), and a conductor (401). The mounting substrate (30) has a first main surface (35) and a second main surface facing each other. The shield layer (33) is provided on the outer surface of a resin layer that covers the first filter (7A) and the second filter (7D). Simultaneous transmission using both the first filter (7A) and the second filter (7D) is possible. The conductor (401) is provided on a first main surface (35) of the mounting substrate (30) and is in contact with the transmission filter (7A) and the mounting substrate (30). The conductor (401) is in contact with the shield layer (33) on a side of the first filter (7A) that is different from that facing the second filter (7D).
Inventors:
TANAKA RUI
Application Number:
PCT/JP2021/040194
Publication Date:
May 05, 2022
Filing Date:
November 01, 2021
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H03H7/46; H04B1/38; H03H9/25; H03H9/72; H04B1/00
Domestic Patent References:
| WO2019244816A1 | 2019-12-26 |
Foreign References:
| JP2005094405A | 2005-04-07 |
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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