Title:
HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/118891
Kind Code:
A1
Abstract:
The present invention improves the heat dissipation properties of a power amplifier. A high frequency module (100) is provided with: a mounting board (10); at least one power amplifier (1, 2); an electronic component; a resin layer (105); a conductive member; and a plurality of via conductors (40). The power amplifier (1, 2) is mounted on a first main surface (101) of the mounting board (10). The electronic component is mounted on a second main surface (102) of the mounting board (10). The resin layer (105) is arranged on the first main surface (105) of the mounting board (10), and covers at least a part of the power amplifier (1, 2). The conductive member covers at least a part of the resin layer (105), while covering at least a part of an outer peripheral surface (103) of the mounting board (10). The plurality of via conductors (40) are connected to the power amplifier (1, 2), while penetrating through the mounting board (10). At least one via conductor (40) among the plurality of via conductors (40) is in contact with the conductive member.
Inventors:
ONO MAYUKA
TSUDA MOTOJI
ARIMA KEISUKE
TSUDA MOTOJI
ARIMA KEISUKE
Application Number:
PCT/JP2021/044117
Publication Date:
June 09, 2022
Filing Date:
December 01, 2021
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/36; H01L25/04; H01L25/18; H05K1/02; H05K3/46; H05K9/00
Domestic Patent References:
| WO2016080333A1 | 2016-05-26 | |||
| WO2019181761A1 | 2019-09-26 |
Foreign References:
| JP2020126921A | 2020-08-20 | |||
| JP2007295327A | 2007-11-08 | |||
| JP2020027974A | 2020-02-20 | |||
| JP2018098677A | 2018-06-21 |
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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