Title:
HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/176454
Kind Code:
A1
Abstract:
The present invention improves heat dissipation. In a high frequency module, an electronic component (10) comprises a first transmission filter (1), a second transmission filter (2), a first input terminal (T11) and a first output terminal (T12), and a second input terminal (T21) and a second output terminal (T22). The first input terminal (T11) is connected to an input end of a signal path of the first transmission filter (1). The second input terminal (T21) is connected to an input end of a signal path of the second transmission filter (2). The first transmission filter (1) includes a first substrate. The second transmission filter (2) includes a second substrate. The first substrate and the second substrate are common. The electronic component (10) further comprises a metal member (M1) having a ground potential. In a side view of the electronic component (10), the metal member (M1) is disposed between the first input terminal (T11) and the second input terminal (T21).
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Inventors:
TSUDA MOTOJI
Application Number:
PCT/JP2022/000940
Publication Date:
August 25, 2022
Filing Date:
January 13, 2022
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H04B1/00; H03H9/17; H03H9/25; H03H9/54; H03H9/64; H03H9/70; H03H9/72; H04B1/38
Domestic Patent References:
| WO2019240096A1 | 2019-12-19 | |||
| WO2020071021A1 | 2020-04-09 |
Foreign References:
| JP2020027974A | 2020-02-20 | |||
| JP2020102693A | 2020-07-02 |
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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