Title:
HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/186021
Kind Code:
A1
Abstract:
The present invention addresses the problem of suppressing a deterioration in performance. This high-frequency module (1) is provided with a mounting substrate, a first signal terminal (11), a second signal terminal (12), a ground terminal, and a hybrid filter (2). The hybrid filter (2) is connected between the first signal terminal (11) and the second signal terminal (12). The hybrid filter (2) includes an elastic wave filter (20) having at least one elastic wave resonator (24), a first inductor (L4), and a capacitor (C2). A passband width of the hybrid filter (2) is greater than a passband width of the elastic wave resonator (24). A resin layer is disposed on a first main surface of the mounting substrate. The resin layer covers at least part of the elastic wave filter (20). A metal electrode layer covers at least part of the resin layer and is connected to the ground terminal. A second inductor (L5) is connected between the hybrid filter (2) and the second signal terminal (12).
Inventors:
NISHIO KEISUKE
KATO MASANORI
KIDO SYUNSUKE
KATO MASANORI
KIDO SYUNSUKE
Application Number:
PCT/JP2022/007469
Publication Date:
September 09, 2022
Filing Date:
February 24, 2022
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01F17/00; H01F27/00; H01L23/12; H03H7/01; H03H9/25; H03H9/64; H03H9/72; H04B1/00; H04B1/38
Domestic Patent References:
| WO2016013659A1 | 2016-01-28 |
Foreign References:
| JP2021500838A | 2021-01-07 | |||
| JP2017199969A | 2017-11-02 |
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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