HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE

WIPO Patent Application WO/2022/202328

A1

A high frequency module (1A) comprises: a module substrate (80) having main surfaces (80a and 80b) opposing each other; a hybrid filter (11) including a first elastic wave resonator, a first inductor, and a first capacitor; a switch (30) for switching between connection and disconnection of an antenna connection terminal (110) and the hybrid filter (11); and a coupler (75) disposed in a path connecting the antenna connection terminal (110) and the switch (30). The first elastic wave resonator is disposed on the main surface (80a). The switch (30) is included in a semiconductor IC (71) disposed on the main surface (80b). The coupler (75) is disposed in the module substrate (80). When the module substrate (80) is viewed in plan, the semiconductor IC (71) and the first elastic wave resonator at least partly overlap each other, and the semiconductor IC (71) and the coupler (75) at least partly overlap each other.

KIDO SYUNSUKE (JP)
UEJIMA TAKANORI (JP)
MORITO NARU (JP)
MIURA MASANARI (JP)
YAMAGUCHI YUKIYA (JP)
KUROYANAGI TAKUMA (JP)
YASUDA TOMOMI (JP)
KATO MASANORI (JP)
FUKUDA YUUKI (JP)

PCT/JP2022/010316

September 29, 2022

March 09, 2022

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MURATA MANUFACTURING CO (JP)

H04B1/38; H01L23/12; H01L25/00; H03H7/46; H04B1/00

JP2009038807A	2009-02-19
JP2005295503A	2005-10-20
JP2002290257A	2002-10-04
JP2002300081A	2002-10-11
JPH11220312A	1999-08-10

YOSHIKAWA, Shuichi et al. (JP)

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