HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE

WIPO Patent Application WO/2022/209751

A1

This high-frequency module (1A) comprises: a module substrate (91) which has principal surfaces (91a and 91b); a module substrate (92) which has principal surfaces (92a and 92b) and in which the principal surface (92a) faces the principal surface (91b); a plurality of electronic components disposed between the principal surfaces (91b and 92a), on the principal surface (91a), and on the principal surface (92b); and a plurality of external connection terminals (150) disposed on the principal surface (92b), wherein a recess section (80) is formed in the principal surface (91a) of the module substrate (91), the plurality of electronic components include first electronic components (matching circuits (401, 411, 431-433, 441 and 461-463)) and second electronic components (matching circuits (412, 413, 422, 442, 443 and 452)) with a lower profile than the first electronic components, the first electronic components are disposed in the recess section (80), and the second electronic components are disposed on an area other than the recess section (80) of the principal surface (91a).

YAMADA TAKASHI (JP)
AIKAWA KIYOSHI (JP)
KITAJIMA HIROMICHI (JP)
UEJIMA TAKANORI (JP)
DAIMON YOSHIHIRO (JP)

PCT/JP2022/010867

October 06, 2022

March 11, 2022

Click for automatic bibliography generation  

MURATA MANUFACTURING CO (JP)

H01L23/12; H01L25/00; H03H9/25; H04B1/00; H04B1/38; H05K3/46

WO2021039068A1

2021-03-04

JP2009130196A	2009-06-11
JP2004071597A	2004-03-04
JP2004296613A	2004-10-21
JP2003258192A	2003-09-12
JP2001210954A	2001-08-03

YOSHIKAWA, Shuichi et al. (JP)

View/Download PDF      PDF Help

Previous Patent: HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE

Next Patent: METHOD FOR PRODUCING POROUS THERMOPLASTIC RESIN