Title:
HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/220000
Kind Code:
A1
Abstract:
The present invention addresses the problem of lowering the possibility of occurrence of characteristic degradation, by relaxing stress applied to an electronic component disposed on a main surface of a mounting substrate. A high-frequency module (1) according to the present invention comprises: a mounting substrate (100); an electronic component and an external connection terminal; a resin layer; and an insulating layer (130). The electronic component and the external connection terminal (200) are arranged on a second main surface (102) of the mounting substrate (100). The insulating layer (130) is harder than the resin layer. A third main surface of the electronic component is positioned between a fourth main surface of the electronic component and the second main surface (102) of the mounting substrate (100). Of the fourth main surface of the electronic component and the resin layer, the insulating layer (130) is disposed on at least the fourth main surface of the electronic component.
More Like This:
| WO/2014/192689 | WIRELESS COMMUNICATION SYSTEM AND COMMUNICATION METHOD |
| WO/2012/059046 | WIRELESS MODEM |
Inventors:
DEGUCHI HIROKI
Application Number:
PCT/JP2022/011853
Publication Date:
October 20, 2022
Filing Date:
March 16, 2022
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H04B1/38; H01L23/12; H01L25/04; H01L25/18; H04B1/00; H05K1/18; H05K3/28; H05K3/46
Domestic Patent References:
| WO2019216300A1 | 2019-11-14 | |||
| WO2014017159A1 | 2014-01-30 |
Foreign References:
| JP2001244638A | 2001-09-07 | |||
| JP2006086296A | 2006-03-30 | |||
| JP2003051573A | 2003-02-21 | |||
| JP2005210074A | 2005-08-04 | |||
| JP2002170918A | 2002-06-14 |
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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