Title:
HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/230682
Kind Code:
A1
Abstract:
The present invention limits reduction in isolation between terminals. A high frequency module (1) is provided with a mounting substrate (3), a first electronic component (4A) and a second electronic component (4B), a resin layer (51), and a metal electrode layer (6). The first electronic component (4A) and the second electronic component (4B) are disposed on a first main surface (31) of the mounting substrate (3). The metal electrode layer (6) covers at least a part of the resin layer (51), and overlaps at least a part of of the first electronic component (4A) and at least a part of the second electronic component (4B) in a plan view from a thickness direction (D1) of the mounting substrate (3). At least a part of a main surface (41) of the first electronic component (4A) on a side opposite the mounting substrate (3) is in contact with the metal electrode layer (6). The metal electrode layer (6) has a through-portion (61) between the first signal terminal (44A) of the first electronic component (4A) and the second signal terminal (44B) of the second electronic component (4B) in a plan view from the thickness direction (D1) of the mounting substrate (3).
Inventors:
UEJIMA TAKANORI
KITAJIMA HIROMICHI
NAKAGAWA DAI
KITAJIMA HIROMICHI
NAKAGAWA DAI
Application Number:
PCT/JP2022/017827
Publication Date:
November 03, 2022
Filing Date:
April 14, 2022
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/00; H01L23/12; H01L25/00; H03H9/25
Domestic Patent References:
| WO2020017582A1 | 2020-01-23 | |||
| WO2016117196A1 | 2016-07-28 | |||
| WO2018194012A1 | 2018-10-25 |
Foreign References:
| JP2020113559A | 2020-07-27 | |||
| JP2020102693A | 2020-07-02 |
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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