Title:
HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/047957
Kind Code:
A1
Abstract:
Provided are a high frequency module having a reduced size, and a communication device. A high frequency module (1) comprises: a first mounting substrate (2); a first electronic component (4), a second electronic component (5), and a third electronic component (6); an external connection terminal (10); and a second mounting substrate (3). The first mounting substrate (2) has a first major surface (21) and a second major surface (22) opposing each other. The first electronic component (4) is disposed on the first major surface (21) and the external connection terminal (10) is disposed on the second major surface (22) of the first mounting substrate (2). The second mounting substrate (3) is positioned on the second major surface (22) of the first mounting substrate (2). The second mounting substrate (3) has a third major surface (31) and a fourth major surface (32) opposing each other. The third major surface (31) is opposite the second major surface (22) of the first mounting substrate (2). The second electronic component (5) is disposed on the third major surface (31) and the third electronic component (6) is disposed on the fourth major surface (32) of the second mounting substrate (3).
Inventors:
IWANAGA MINORU
Application Number:
PCT/JP2022/033549
Publication Date:
March 30, 2023
Filing Date:
September 07, 2022
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/12; H01L25/00; H04B1/00; H04B1/38
Domestic Patent References:
| WO2020066380A1 | 2020-04-02 | |||
| WO2021124806A1 | 2021-06-24 | |||
| WO2020100849A1 | 2020-05-22 |
Foreign References:
| JP2020140996A | 2020-09-03 | |||
| JP2020102693A | 2020-07-02 | |||
| US20200083172A1 | 2020-03-12 |
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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