Title:
HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/120071
Kind Code:
A1
Abstract:
The present invention mitigates characteristics degradation during simultaneous communication. A plurality of communication bands include two or more communication bands that are included in a first combination of communication bands capable of simultaneous communication and two or more communication bands that are included in a second combination of communication bands capable of simultaneous communication. A plurality of inductors (L0) include two or more first inductors that, among a plurality of reception filters, are connected to two or more reception filters that correspond to the two or more communication bands included in the first combination and two or more second inductors that, among a plurality of reception filters, are connected to two or more reception filters that correspond to the two or more communication bands included in the second combination. As seen in a plan view along the thickness direction of a mounting board (9), at least one second inductor among the two or more second inductors is located between two first inductors among the two or more first inductors.
Inventors:
TANAKA RUI
Application Number:
PCT/JP2022/044135
Publication Date:
June 29, 2023
Filing Date:
November 30, 2022
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H04B1/00; H01L25/00; H03F3/19; H03H7/46; H04B1/38
Domestic Patent References:
| WO2021100246A1 | 2021-05-27 | |||
| WO2020054284A1 | 2020-03-19 | |||
| WO2021124691A1 | 2021-06-24 |
Foreign References:
| JP2017098632A | 2017-06-01 |
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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