Title:
HIGH-FREQUENCY MODULE AND SIGNAL AMPLIFICATION METHOD
Document Type and Number:
WIPO Patent Application WO/2023/112651
Kind Code:
A1
Abstract:
A high-frequency module (1) comprises: a high-frequency input terminal (101); a power amplification device (10) that is operated in accordance with at least two power modes; and an attenuation circuit (40). The power amplification device (10) includes: a first amplifier (11) having an input terminal (11a) and an output terminal (11b); and a second amplifier (12) having an input terminal (12a) and an output terminal (12b). The input terminal (11a) is connected to the high-frequency input terminal (101). The output terminal (11b) is connected to the input terminal (12a). The attenuation circuit (40) is disposed on a path (81) connecting the high-frequency input terminal (101) and the input terminal (11a).
Inventors:
MORITA KYOHEI (JP)
Application Number:
PCT/JP2022/043795
Publication Date:
June 22, 2023
Filing Date:
November 28, 2022
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H03G3/10; H03F3/24; H03F3/68; H03G3/30; H04B1/04; H04B1/38
Foreign References:
| JP2015126411A | 2015-07-06 | |||
| JPS59154941U | 1984-10-17 | |||
| JP2021175073A | 2021-11-01 | |||
| JP2007089207A | 2007-04-05 |
Attorney, Agent or Firm:
YOSHIKAWA, Shuichi et al. (JP)
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