Title:
HIGH-FREQUENCY MODULE
Document Type and Number:
WIPO Patent Application WO/2016/006676
Kind Code:
A1
Abstract:
Provided is a high-frequency module equipped with a multilayer substrate with which it is possible to configure a directional coupler with which interference with other high-frequency circuit elements can be suppressed and properties can be easily adjusted. Because an inductor component (42) is disposed outside a multilayer substrate (2), it is possible to suppress the interference of a directional coupler (4), which is formed of an internal wiring electrode (41) and a coil electrode (42a) inside the inductor component (42) that is mounted to land electrodes (21, 22) of the multilayer substrate (2), with other high-frequency circuit elements arranged in the multilayer substrate (2). Furthermore, the present invention makes it possible to provide a high-frequency module (1) equipped with a multilayer substrate (2) with which it is possible to configure a directional coupler (4) with which inductor properties can be easily adjusted just by preparing a plurality of inductor components (42) having different inductor properties, and selecting and substituting a given inductor component (42) from among the inductor components (42).
Inventors:
HANAOKA KUNITOSHI (JP)
Application Number:
PCT/JP2015/069837
Publication Date:
January 14, 2016
Filing Date:
July 10, 2015
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01P5/18
Foreign References:
| JP2012244324A | 2012-12-10 | |||
| JP2006191221A | 2006-07-20 | |||
| JPH08505750A | 1996-06-18 | |||
| JP2000165116A | 2000-06-16 |
Attorney, Agent or Firm:
YANASE, Yuji et al. (JP)
Yuji Yanase (JP)
Yuji Yanase (JP)
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