Title:
HIGH FREQUENCY MODULE
Document Type and Number:
WIPO Patent Application WO/2019/167908
Kind Code:
A1
Abstract:
Provided is a high frequency module with which it is possible to suppress the influence of heat on a component which is subject to characteristics variations due to heat, while maintaining the heat-dissipating efficiency of a component that generates heat. The high frequency module 1a is provided with: a wiring board 2; a first component 3a which is mounted on an upper surface 20a of the wiring board 2 and readily undergoes characteristics variations due to heat; a second component 3b which is a heat-generating component; a sealing resin layer 4 with which components 3a to 3c are coated; a shield film 5 covering a surface of the sealing resin layer 4; and a heat-dissipating member 6 which is disposed on an upper surface 4a of the sealing resin layer 4. The upper surface 4a of the sealing resin layer 4 has formed therein a recess 11 as viewed from a direction perpendicular to the upper surface 20a of the wiring board 2. The recess 11 makes it possible to prevent the heat generated from the second component 3b from having an influence on the first component 3a.
Inventors:
OTSUBO YOSHIHITO (JP)
SATO SHOTA (JP)
SATO SHOTA (JP)
Application Number:
PCT/JP2019/007173
Publication Date:
September 06, 2019
Filing Date:
February 26, 2019
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/29; H01L23/00; H05K9/00
Foreign References:
| JP2017028060A | 2017-02-02 | |||
| JP2008034778A | 2008-02-14 | |||
| JP2018026394A | 2018-02-15 | |||
| JP2018019057A | 2018-02-01 | |||
| JP2003124663A | 2003-04-25 |
Attorney, Agent or Firm:
YANASE, Yuji et al. (JP)
Download PDF:
Previous Patent: GASKET CUTTER AND METHOD FOR MANUFACTURING GASKET
Next Patent: HEAT EXCHANGER UNIT AND AIR CONDITIONER USING SAME
Next Patent: HEAT EXCHANGER UNIT AND AIR CONDITIONER USING SAME