Title:
HIGH-FREQUENCY MODULE
Document Type and Number:
WIPO Patent Application WO/2022/113545
Kind Code:
A1
Abstract:
This high frequency module (1) comprises: a first base material (71) on which an electric circuit is formed, a second base material (72) on which a power amplification circuit (11) is formed, a matching component (41D) which is arranged outside the first base material (71) and the second base material (72) and at which a first matching element connected to a power amplification circuit (11) is formed, and a module substrate (90) having a main surface (90a) on which the first base material (71), the second base material (72), and the matching component (41D) are arranged, wherein the first base material (71) is joined to the main surface (90a) through an electrode (717), the second base material (72) is arranged between the module substrate (90) and the first base material (71) in a cross-sectional view and is joined to the main surface (90a) through an electrode (724), and at least a part of the first base material (71) overlaps with at least a part of the second base material (72) in a plan view.
Inventors:
TAKEMATSU YUJI (JP)
Application Number:
PCT/JP2021/037686
Publication Date:
June 02, 2022
Filing Date:
October 12, 2021
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H04B1/38; H01L25/04; H01L25/18
Domestic Patent References:
| WO2020090557A1 | 2020-05-07 |
Foreign References:
| JP2002359327A | 2002-12-13 | |||
| JP2020102693A | 2020-07-02 | |||
| JPH08335836A | 1996-12-17 |
Attorney, Agent or Firm:
YOSHIKAWA, Shuichi et al. (JP)
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