HIGH FREQUENCY MODULE

WIPO Patent Application WO/2022/209740

A1

A high frequency module (1A) comprising: a module substrate (91) having main surfaces (91a and 91b) opposing each other; a module substrate (92) having main surfaces (92a and 92b) opposing each other with the main surface (92a) disposed facing the main surface (91b); a first electronic component including a filter (61) connected to a power amplifier (11) via a switch (52); a second electronic component including a filter (62) connected to the power amplifier (11) via the switch (52); and a third electronic component including the switch (52). The first electronic component is disposed in one of the locations between the main surfaces (91b and 92a), on the main surface (91a), and on the main surface (92b). The second electronic component is disposed in another of the locations between the main surfaces (91b and 92a), on the main surface (91a), and on the main surface (92b). The third electronic component is disposed in the remaining one of the locations between the main surfaces (91b and 92a), on the main surface (91a), and on the main surface (92b).

JPS5335411	COMMUNICATING METHOD FOR DUAL DIRECTIONS
WO/1994/027381	DYNAMIC CONTROL OF TRANSMITTING POWER AT A TRANSMITTER AND ATTENUATION AT A RECEIVER
WO/1999/049584	DEVICE MADE OF PLASTIC MATERIAL FOR MOBILE FIXATION OF CELLULAR TELEPHONES BY MEANS OF MAGNETIC ATTRACTION

KITAJIMA HIROMICHI (JP)
UEJIMA TAKANORI (JP)
AIKAWA KIYOSHI (JP)
DAIMON YOSHIHIRO (JP)
YAMADA TAKASHI (JP)

PCT/JP2022/010818

October 06, 2022

March 11, 2022

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MURATA MANUFACTURING CO (JP)

H04B1/38

WO2020022180A1	2020-01-30
WO2017077852A1	2017-05-11
WO2019004152A1	2019-01-03

US20200343930A1	2020-10-29
JP2020126921A	2020-08-20

YOSHIKAWA, Shuichi et al. (JP)

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