Title:
HIGH FREQUENCY SUBSTRATE, HIGH FREQUENCY PACKAGE AND HIGH FREQUENCY MODULE
Document Type and Number:
WIPO Patent Application WO/2017/170389
Kind Code:
A1
Abstract:
A high frequency substrate 1 according to one embodiment of the present invention is provided with an insulating base 2, a first line conductor 3, a second line conductor 4, a capacitor 5, a first bonding material 6 and a second bonding material 7. The insulating base 2 has a recess 21 in the upper surface. The first line conductor 3 is arranged on the upper surface of the insulating base 2 so as to extend from an end of the recess 21. The second line conductor 4 is arranged on the upper surface of the insulating base 2 so as to face the first line conductor 3 across the recess 21. The capacitor 5 is arranged so as to overlap the recess 21. The first bonding material 6 bonds the capacitor 5 and the first line conductor 3 with each other. The second bonding material 7 bonds the capacitor 5 and the second line conductor 4 with each other, while being arranged at a distance from the first bonding material 6.
Inventors:
KAWAZU YOSHIKI (JP)
Application Number:
PCT/JP2017/012371
Publication Date:
October 05, 2017
Filing Date:
March 27, 2017
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H05K1/18; H01L23/13; H05K3/34; H05K3/46
Domestic Patent References:
| WO2015162768A1 | 2015-10-29 | |||
| WO2015030093A1 | 2015-03-05 |
Foreign References:
| JP2006032783A | 2006-02-02 | |||
| JPS5013471B1 | 1975-05-20 | |||
| JP2005050974A | 2005-02-24 |
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