HIGH PERFORMANCE, THERMALLY CONDUCTIVE SURFACE MOUNT (DIE ATTACH) ADHESIVES

Title:

HIGH PERFORMANCE, THERMALLY CONDUCTIVE SURFACE MOUNT (DIE ATTACH) ADHESIVES

Document Type and Number:

WIPO Patent Application WO/2017/022191

Kind Code:

A1

Abstract:

A composition including (a) 20 to 85 wt% of a thermally conductive silver component containing silver nano-particles having a particle diameter of 5 to 500 nanometers; (b) a polyorgano-silsesquioxane component, the polyorganosilsesquioxane component selected from the group consisting of (i) 0.5 to 12 wt% of a polyorganosilsesquioxane fine powder, (ii) 0.5 to 8 wt% of a copolymer powder containing an interlacing polymer network of (I) a polyorganosilsesquioxane and (II) a polydiorganosiloxane; and (iii) 0.5 to 12 wt% of a combination of the polyorgano-silsesquioxane fine powder and the copolymer powder; and (c) 3 to 12 wt% of a total solvent content in the form of (i) one or more solvents, (ii) a vehicle containing one or more solvents, or (iii) a combination thereof.

Inventors:

TRUMBLE CATHY SHAW (US)
PATELKA MACIEJ (US)
SAKAI NORIYUKI (US)
KRASCO NICHOLAS C (US)

Application Number:

PCT/JP2016/003363

Publication Date:

February 09, 2017

Filing Date:

July 15, 2016

Export Citation:

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Assignee:

NAMICS CORP (JP)

International Classes:

C08L83/04; C08K3/08; C09J11/04; C09J11/06; C09J183/04

Domestic Patent References:

WO2015108205A1	2015-07-23
WO2014084275A1	2014-06-05
WO2013133085A1	2013-09-12

Foreign References:

JP2014089818A	2014-05-15
JP2011088947A	2011-05-06

Other References: