Title:
HIGH-POWER LED LIGHT SOURCE MODULE CAPABLE OF OPTIMIZING HEAT DISSIPATION
Document Type and Number:
WIPO Patent Application WO/2024/031794
Kind Code:
A1
Abstract:
Provided is a high-power LED light source module capable of optimizing heat dissipation, which comprises a base (3), a rear board (5), an LED chip board, and a glass window sheet (1). The base (3) is a carrier of the whole light source module; a water-passing groove for introducing cooling water is formed in the back surface of the base (3), and the base and the rear board (5) are tightly pressed and sealed through a sealing ring (4); a plurality of LED chips (2) connected in series form the LED chip board and are mounted on the front surface of the base (3); and finally, the glass window sheet (1) is used to seal the front surface of the whole base (3). According to the high-power LED light source module capable of optimizing heat dissipation, the high-power LED chips (2) are used as a near-infrared light source to replace a traditional EEL semiconductor laser, a horizontal heat transfer form is replaced with a vertical heat transfer form, and long-strip chip cutting is replaced with square chip cutting, so that the maximum heat flux density, the thermal resistance and the temperature gradient of the light source are greatly improved, and the refrigeration requirement is reduced. Meanwhile, the fatigue damage of a thermal stress to welding during long-pulse-width and repeated-frequency work is reduced, the reliability of the light source is improved, and the service life of the light source is prolonged.
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Inventors:
PAN SHAOHUI (CN)
HONG YAOSHUN (CN)
HONG YAOSHUN (CN)
Application Number:
PCT/CN2022/120695
Publication Date:
February 15, 2024
Filing Date:
September 23, 2022
Export Citation:
Assignee:
SHENZHEN LEAFLIFE TECH CO LTD (CN)
International Classes:
A61N5/06
Foreign References:
| CN101612452A | 2009-12-30 | |||
| CN103836409A | 2014-06-04 | |||
| CN102130421A | 2011-07-20 | |||
| CN107174751A | 2017-09-19 | |||
| CN214342588U | 2021-10-08 | |||
| FR3077210A1 | 2019-08-02 |
Attorney, Agent or Firm:
BEIJING FINELAND IP FIRM (CN)
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