Title:
HIGH-PURITY ELECTROLYTIC COPPER
Document Type and Number:
WIPO Patent Application WO/2018/221724
Kind Code:
A1
Abstract:
The present invention exhibits a Cu purity excluding gas components (O, F, S, C, Cl) of 99.9999 mass% or higher, an S content of 0.1 mass ppm or less, and an area ratio of crystals having a (101) ±10° orientation of less than 40% when crystal orientation is measured by electron backscatter diffraction in a cross-section extending in the thickness direction.
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Inventors:
TARUTANI YOSHIE (JP)
KUBOTA KENJI (JP)
NAKAYA KIYOTAKA (JP)
ARAI ISAO (JP)
KUBOTA KENJI (JP)
NAKAYA KIYOTAKA (JP)
ARAI ISAO (JP)
Application Number:
PCT/JP2018/021178
Publication Date:
December 06, 2018
Filing Date:
June 01, 2018
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
C25C1/12
Domestic Patent References:
| WO2017033694A1 | 2017-03-02 |
Foreign References:
| JP2005533187A | 2005-11-04 | |||
| JP2014015677A | 2014-01-30 | |||
| JPS63203784A | 1988-08-23 | |||
| JP2017109244A | 2017-06-22 | |||
| JP2017110418A | 2017-06-22 | |||
| JP2018097318A | 2018-06-21 | |||
| JP2018097319A | 2018-06-21 | |||
| JPH08990B2 | 1996-01-10 | |||
| JP2005307343A | 2005-11-04 | |||
| JP4620185B2 | 2011-01-26 |
Other References:
See also references of EP 3633072A4
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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