Title:
HIGH-RESOLUTION MONITORING SYSTEM AND METHOD FOR PROCESSING MACHINE
Document Type and Number:
WIPO Patent Application WO/2023/092311
Kind Code:
A1
Abstract:
A high-resolution monitoring system and method for a processing machine, being capable of optimizing processing conditions and providing real-time feedback, and comprising a micro-electromechanical component (11) and an analysis apparatus (2), wherein the micro-electromechanical component (11) detects vibration generated during processing, sets peak values of vibration changes within short periods of time as value points, and instantly transmits the value points to the analysis apparatus (2); the analysis apparatus (2) draws a high-resolution processing waveform pattern by using the value points, calculates a numerical value and an overall linear condition within each period of time, and finally determines a processing state according to the reproductivity of the processing waveform pattern, the overall trend line slope of a vibration peak value, the deformation mode of the waveform pattern, and a peak-valley difference value. Different from frequency domain analysis in the prior art, the method is simple in principle and has better universality.
Inventors:
TSAI KUO-CHIH (CN)
PAN CHUN-PIN (CN)
PAN CHUN-PIN (CN)
Application Number:
PCT/CN2021/132611
Publication Date:
June 01, 2023
Filing Date:
November 24, 2021
Export Citation:
Assignee:
TSAI KUO CHIH (CN)
International Classes:
G01H17/00; B23Q17/09; B23Q17/12; G01H1/00
Foreign References:
| JP2008087093A | 2008-04-17 | |||
| CN1352586A | 2002-06-05 | |||
| CN102179728A | 2011-09-14 | |||
| CN109732405A | 2019-05-10 | |||
| CN103760820A | 2014-04-30 | |||
| CN110587377A | 2019-12-20 | |||
| CN109909804A | 2019-06-21 | |||
| JP2010048758A | 2010-03-04 |
Attorney, Agent or Firm:
TDIP & PARTNERS (CN)
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