HIGH-STRENGTH HOT-DIP-GALVANIZED STEEL SHEET AND PRODUCTION METHOD FOR SAME

Title:

HIGH-STRENGTH HOT-DIP-GALVANIZED STEEL SHEET AND PRODUCTION METHOD FOR SAME

Document Type and Number:

WIPO Patent Application WO/2024/053544

Kind Code:

A1

Abstract:

According to the present invention, a method for producing a high-strength hot-dip-galvanized steel sheet that has at least 20 g/m2 but no more than 120 g/m2 of a galvanization layer deposited on the surface of each side of a steel sheet that has a component composition that contains prescribed components, the mass ratio (Si/Mn) of Si and Mn being at least 0.25, and the remainder being Fe and unavoidable impurities, involves performing annealing and hot-dip-galvanization treatments on a steel sheet at continuous hot-dip-galvanization equipment such that the maximum temperature T of the steel sheet at an annealing furnace is no more than 900°C and the dew point X of the atmosphere inside the furnace when the temperature of the steel sheet is at least 700°C but no more than T°C is controlled to at least the dew point calculated from expression (1) and such that the atmosphere inside the furnace contains 3.0–20.0 vol% of hydrogen and at least one of 0.1–3.0 vol ppm of SO2 and 0.5–10.0 vol ppm of HCl, the remainder being nitrogen and unavoidable impurities.　(1): Dew point X≥(-50+[Si mass%]×(T-600)/30+[Mn mass%]×(T-600)/25)

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Inventors:

KOBA MASAKI (JP)
HOSHINO KATSUYA (JP)
MAKIMIZU YOICHI (JP)
HIRASHIMA TAKUYA (JP)
WATANABE MAIKO (JP)
TAKEDA GENTARO (JP)
NAITO KYOKO (JP)
OZAWA YUICHI (JP)

Application Number:

PCT/JP2023/031755

Publication Date:

March 14, 2024

Filing Date:

August 31, 2023

Export Citation:

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Assignee:

JFE STEEL CORP (JP)

International Classes:

C21D9/46; C21D1/26; C21D1/76; C21D9/56; C22C38/00; C22C38/06; C22C38/60; C23C2/06; C23C2/16

Domestic Patent References:

WO2021166350A1	2021-08-26
WO2022017138A1	2022-01-27

Foreign References:

JP2012072451A	2012-04-12
JP2011246744A	2011-12-08
JPH1150223A	1999-02-23

Attorney, Agent or Firm:

KUMASAKA Akira et al. (JP)

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