Title:
HIGH-STRENGTH SOLDER ALLOY
Document Type and Number:
WIPO Patent Application WO/1995/034401
Kind Code:
A1
Abstract:
A solder alloy having higher mechanical strengths and excellent wettability, which comprises 0.0005 to 0.35 wt.% of Si, 0 to 5.0 wt.% of Ag, 0 to 10.0 wt.% of Sb, 0 to 10.0 wt.% of Bi, 20 to 95 wt.% of Sn, 0 to 70 wt.% of Pb and 0 to 0.5 wt.% of Ca.
Inventors:
KAWAGUCHI TORANOSUKE (JP)
HAYASHI TAKAYUKI (JP)
HAYASHI TAKAYUKI (JP)
Application Number:
PCT/JP1995/000531
Publication Date:
December 21, 1995
Filing Date:
March 23, 1995
Export Citation:
Assignee:
NIHON ALMIT CO LTD (JP)
KAWAGUCHI TORANOSUKE (JP)
HAYASHI TAKAYUKI (JP)
KAWAGUCHI TORANOSUKE (JP)
HAYASHI TAKAYUKI (JP)
International Classes:
B23K35/26; C22C11/06; C22C13/00; (IPC1-7): B23K35/26
Foreign References:
| JPS63123594A | 1988-05-27 | |||
| JPS5524720A | 1980-02-22 | |||
| JPS4521580B1 |
Other References:
See also references of EP 0748666A4
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