HIGH TEMPERATURE LEAD-FREE SOLDER AND PACKAGE FOR STORING SEMICONDUCTOR ELEMENT

WIPO Patent Application WO/2006/049024

A1

[PROBLEMS] Recently, a lead-free solder containing Sn as a main component has been frequently used from the view point of regulatory constrains to Pb. The lead-free solder has a liquidus line temperature near 220&ring C, and therefore, when the lead-free solder is used for mounting, a high temperature solder is required to have a solidus line temperature of 270&ring C or higher. An Au-Sn eutectic alloy is known to have a solidus line temperature of 270&ring C or higher. The eutectic alloy is expensive, since it has a high content of Au. [MEANS FOR SOLVING PROBLEMS] A high temperature solder which contains 2 to 12 mass % of Ag, 40 to 55 mass % of Au and the balanced amount of Sn; and a package for storing a semiconductor in which a body of a container and a lid member is joined by the use of said high temperature solder.

JP2009527111	Bonding wire
JP6413668	Au-Sn-Ag-based solder alloy and solder material, as well as electronic components and electronic component mounting equipment sealed using this solder alloy or solder material.

KATO RIKIYA (JP)
AZUMA TAKENORI (JP)

PCT/JP2005/019472

May 11, 2006

October 24, 2005

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SENJU METAL INDUSTRY CO (JP)
KATO RIKIYA (JP)
AZUMA TAKENORI (JP)

C22C5/02; B23K35/26; B23K35/30; C22C13/00; H01L23/10

JP2001009587A	2001-01-16
JP2004261863A	2004-09-24

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