Title:
HIGH-TEMPERATURE LEAD-FREE SOLDER ALLOY
Document Type and Number:
WIPO Patent Application WO/2014/024271
Kind Code:
A1
Abstract:
Provided is an Sn-Sb-Ag-Cu based high-temperature lead-free solder alloy which does not form any low-melting phase even when solidified at a low cooling rate and which exhibits excellent joint reliability. This solder alloy has an alloy composition which comprises, in mass%, 35-40% Sb, 13-18% Ag, 6-8% Cu, and the balance Sn.
Inventors:
UESHIMA MINORU (JP)
FUJIMAKI REI (JP)
FUJIMAKI REI (JP)
Application Number:
PCT/JP2012/070185
Publication Date:
February 13, 2014
Filing Date:
August 08, 2012
Export Citation:
Assignee:
SENJU METAL INDUSTRY CO (JP)
UESHIMA MINORU (JP)
FUJIMAKI REI (JP)
UESHIMA MINORU (JP)
FUJIMAKI REI (JP)
International Classes:
B23K35/26; B23K35/28; C22C12/00; C22C13/02; C22C30/02; C22C30/04
Foreign References:
| JP2007152385A | 2007-06-21 | |||
| JP2003290976A | 2003-10-14 | |||
| JP2004298931A | 2004-10-28 | |||
| JP2005340267A | 2005-12-08 | |||
| JP2007152385A | 2007-06-21 | |||
| JP2005340268A | 2005-12-08 |
Other References:
See also references of EP 2716401A4
Attorney, Agent or Firm:
HIROSE SHOICHI (JP)
Hirose Shoichi (JP)
Hirose Shoichi (JP)
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