Title:
HIGH-TEMPERATURE-RESISTANT POLYIMIDE ADHESIVE FILM AND PREPARATION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2019/075786
Kind Code:
A1
Abstract:
A high-temperature-resistant polyimide adhesive film and a preparation method therefor, for use in resolving the problems that the existing plate core adhesive-polyimide adhesive film for adhering honeycombs with a skin plate is poor in heat resistance, and the adhesion of a plate core structure has no climbing and adhesive fillet. The high-temperature-resistant polyimide adhesive film is prepared from a polyimide solution, an inorganic filler modifier and an interfacial coupling agent. The preparation method comprises the following steps: at a certain temperature and in a stirring condition, adding an inorganic filler modifier and an interfacial coupling agent into a polyimide solution, stirring to obtain an adhesive; filtering and degassing the adhesive, performing curtain coating onto a stainless steel rotor drum loaded with carrier cloth and isolating paper so as to obtain a film having self-supporting performance, and then heating and annealing to obtain the high-temperature-resistant polyimide adhesive film.
Inventors:
LIU CHANGWEI (CN)
XIAO WANBAO (CN)
QU CHUNYAN (CN)
WANG DEZHI (CN)
XU KAI (CN)
WANG BO (CN)
LI HONGFENG (CN)
FENG HAO (CN)
GUAN YUEYU (CN)
YANG HAIDONG (CN)
WANG HAIMIN (CN)
ZHANG YANG (CN)
DU CHENG (CN)
ZHOU DONGPENG (CN)
XIAO WANBAO (CN)
QU CHUNYAN (CN)
WANG DEZHI (CN)
XU KAI (CN)
WANG BO (CN)
LI HONGFENG (CN)
FENG HAO (CN)
GUAN YUEYU (CN)
YANG HAIDONG (CN)
WANG HAIMIN (CN)
ZHANG YANG (CN)
DU CHENG (CN)
ZHOU DONGPENG (CN)
Application Number:
PCT/CN2017/109142
Publication Date:
April 25, 2019
Filing Date:
November 02, 2017
Export Citation:
Assignee:
INST OF PETROLEUM CHEMISTRY HEILONGJIANG ACADEMY OF SCIENCES (CN)
International Classes:
C08G73/12; C08L79/08; C08J5/18; C08K3/22; C08K3/28; C08K3/34; C08K3/36; C08K3/38; C08K9/04; C08K9/06
Domestic Patent References:
| WO2012165448A1 | 2012-12-06 |
Foreign References:
| JP2015093915A | 2015-05-18 | |||
| CN105709611A | 2016-06-29 |
Other References:
MA, X.Y. ET AL.: "Preparation and Properties of Imidazole-containing Polyimide/Silica Hybrid Films", CHEM. RES. CHIN. UNIV., vol. 30, no. 6, 31 December 2014 (2014-12-31), pages 1047 - 1050
MA, X.Y. ET AL.: "Effect of Multiple H-Bonding on the Properties of Polyimides Containing the Rigid Rod Groups", JOURNAL OF POLYMER SCIENCE PART A-POLYMER CHEMISTRY, vol. 54, no. 4, 28 August 2015 (2015-08-28), pages 570 - 581, XP055382438, DOI: doi:10.1002/pola.27808
MA, X.Y. ET AL.: "Effect of Multiple H-Bonding on the Properties of Polyimides Containing the Rigid Rod Groups", JOURNAL OF POLYMER SCIENCE PART A-POLYMER CHEMISTRY, vol. 54, no. 4, 28 August 2015 (2015-08-28), pages 570 - 581, XP055382438, DOI: doi:10.1002/pola.27808
Attorney, Agent or Firm:
HARBIN SONGHUAJIANG PATENT TRADEMARK OFFICE et al. (CN)
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