Title:
HIGHLY ADHESIVE THERMOPLASTIC RESIN FILM
Document Type and Number:
WIPO Patent Application WO/2011/068112
Kind Code:
A1
Abstract:
Disclosed is a highly adhesive thermoplastic resin film which is substantially free from decrease in adhesion under high temperature high humidity conditions.
Specifically disclosed is a highly adhesive thermoplastic resin film which comprises a coating layer on at least one surface of a base film. The highly adhesive thermoplastic resin film is characterized in that the coating layer contains (a) a urethane resin that contains a polycarbonate polyol as a component, and/or a polyester resin that does not substantially contain a carboxylic acid group and has a number average molecular weight of not less than 15,000, and (b) a carbodiimide compound.
Inventors:
ITOH KOJI (JP)
YAMAZAKI ATSUSHI (JP)
YABUKI HIROKO (JP)
SAWADA KAORU (JP)
MIZUNO NAOKI (JP)
HIGASHIURA SHINYA (JP)
YAMAZAKI ATSUSHI (JP)
YABUKI HIROKO (JP)
SAWADA KAORU (JP)
MIZUNO NAOKI (JP)
HIGASHIURA SHINYA (JP)
Application Number:
PCT/JP2010/071434
Publication Date:
June 09, 2011
Filing Date:
December 01, 2010
Export Citation:
Assignee:
TOYO BOSEKI (JP)
ITOH KOJI (JP)
YAMAZAKI ATSUSHI (JP)
YABUKI HIROKO (JP)
SAWADA KAORU (JP)
MIZUNO NAOKI (JP)
HIGASHIURA SHINYA (JP)
ITOH KOJI (JP)
YAMAZAKI ATSUSHI (JP)
YABUKI HIROKO (JP)
SAWADA KAORU (JP)
MIZUNO NAOKI (JP)
HIGASHIURA SHINYA (JP)
International Classes:
B32B27/36; B32B27/40; C08J7/04; C09D5/00; C09D167/00; C09D175/04; G02B1/10; G02B5/02; G02B5/04; G02B5/22; H01B5/14
Domestic Patent References:
| WO2007032295A1 | 2007-03-22 |
Foreign References:
| JP2001207111A | 2001-07-31 | |||
| JPH08332706A | 1996-12-17 | |||
| JP2008255266A | 2008-10-23 | |||
| JP2009234009A | 2009-10-15 |
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