Title:
HIGHLY DIELECTRIC FILM, USAGES THEREOF, AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2017/183541
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a highly dielectric film that is formed of a fluoroalkyl-group-containing organopolysiloxane cured product and that is characterized in that the dielectric constant thereof is high, and that the film is substantially flat and uniform in the width direction of the film, as well as to provide usages thereof and a manufacturing method therefor. With the highly dielectric film formed of the fluoroalkyl-group-containing organopolysiloxane cured product, in the width direction of the film, the difference between the thickness at an end and the thickness at the center is 5.0% or less, and the thickness at the film center falls within a range of 50-1000 μm. Such a film may be provided with a primer layer and a planarization layer, and the film may be obtained by means of rolling and may also be obtained by means of curing performed between separators provided with separation layers.
Inventors:
FUKUI HIROSHI (JP)
MASATOMI TORU (JP)
TSUDA TAKEAKI (JP)
MASATOMI TORU (JP)
TSUDA TAKEAKI (JP)
Application Number:
PCT/JP2017/015028
Publication Date:
October 26, 2017
Filing Date:
April 12, 2017
Export Citation:
Assignee:
DOW CORNING TORAY CO LTD (JP)
International Classes:
C08J5/18; B32B27/00; C08J7/043; H01B3/46
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Other References:
See also references of EP 3447082A4
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