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Patent Searching and Data


Title:
HIGHLY HEAT-DISSIPATING COMPOSITION USING MIXTURE FILLER AND PREPARATION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2021/251533
Kind Code:
A1
Abstract:
The present invention relates to a highly heat-dissipating composition using a mixture filler and a preparation method therefor, wherein the heat-dissipating composition comprises: a filler containing two or more of expanded graphite, carbon nanotubes, graphene, and metal nanoparticles; and a base polymer containing a silicone-based resin.

Inventors:
HWANG IN SEONG (KR)
PARK YONG SOO (KR)
HWANG IN CHAN (KR)
PARK KYUNG HEE (KR)
Application Number:
PCT/KR2020/007678
Publication Date:
December 16, 2021
Filing Date:
June 12, 2020
Export Citation:
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Assignee:
DAESHIN TECHGEN CO LTD (KR)
International Classes:
C09K5/08; C08J3/20; C08K3/04; C08K3/08; C08L83/04; C09D7/61; C09D183/04; C09J183/04
Foreign References:
KR20170102590A2017-09-12
CN110800388A2020-02-14
KR20170105546A2017-09-19
KR20160041310A2016-04-18
KR20160021061A2016-02-24
JP2015216353A2015-12-03
Attorney, Agent or Firm:
IPCJ PATENT & LAW FIRM (KR)
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