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Patent Searching and Data


Title:
HIGHLY HEAT-RESISTANT RESIN COMPOSITE INCLUDING CHEMICALLY MODIFIED, FINE CELLULOSE FIBERS
Document Type and Number:
WIPO Patent Application WO/2019/230970
Kind Code:
A1
Abstract:
Provided is a resin composite having high mechanical properties which make the resin composite moldable into and usable as members for use in applications such as vehicle-mounted members and electrical materials. The resin composite comprises 0.5-40 mass% chemically modified, fine cellulose fibers and a resin, wherein the chemically modified, fine cellulose fibers have a pyrolysis initiation temperature (TD) of 270°C or higher, a number-average fiber diameter of 10 nm or larger but less than 1 μm, and a degree of crystallinity of 60% or higher. In a preferred embodiment, the chemically modified, fine cellulose fibers have a coefficient of variation (CV) in DS unevenness ratio, DSs/DSt, of 50% or less, the DS unevenness ratio being the ratio of the modification degree (DSs) of the surface layers of the fibers to the modification degree (DSt) of the whole of the fibers.

Inventors:
ONO HIROFUMI (JP)
KAWAHARA KAZUFUMI (JP)
OZAWA RYOSUKE (JP)
OHGA MASAHIRO (JP)
Application Number:
PCT/JP2019/021845
Publication Date:
December 05, 2019
Filing Date:
May 31, 2019
Export Citation:
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Assignee:
ASAHI CHEMICAL IND (JP)
International Classes:
C08J5/06; C08L1/10; C08L101/00; D21H11/18; D21H13/02
Domestic Patent References:
WO2017135413A12017-08-10
WO2016010016A12016-01-21
WO2016148233A12016-09-22
WO2017073700A12017-05-04
WO2017159823A12017-09-21
Foreign References:
JP2013044076A2013-03-04
JP2013043984A2013-03-04
JP2017095831A2017-06-01
JP2011213754A2011-10-27
JP2011016995A2011-01-27
JP2016089077A2016-05-23
JP2014180777A2014-09-29
JP2013044076A2013-03-04
JP2013043984A2013-03-04
JP2010104768A2010-05-13
JPH07228775A1995-08-29
JP2003055549A2003-02-26
Other References:
"Mokushitsu Kagaku Jikken Manual", 2000, pages: 92 - 97
"Polymer Process Engineering", 1994, PRENTICE-HALL, INC, pages: 291 - 294
Attorney, Agent or Firm:
AOKI, Atsushi et al. (JP)
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