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Title:
HOLDING MEMBRANE FORMING FILM
Document Type and Number:
WIPO Patent Application WO/2014/092200
Kind Code:
A1
Abstract:
[Problem] To provide a holding membrane forming film which, after curing while temporarily fixed to a support body, is easily removed from the support body, and which has excellent strength of adhesion to a chip. [Solution] This curable holding membrane forming film has a first surface and a second surface, and the adhesive force to a silicon wafer of the first surface after curing is greater than the adhesive force to a silicon wafer of the second surface after curing.

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Inventors:
SAIKI NAOYA (JP)
YAMAMOTO DAISUKE (JP)
TAKANO KEN (JP)
Application Number:
PCT/JP2013/083628
Publication Date:
June 19, 2014
Filing Date:
December 16, 2013
Export Citation:
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Assignee:
LINTEC CORP (JP)
International Classes:
C09J7/10; H01L21/301
Foreign References:
JP2012033637A2012-02-16
JP2000248243A2000-09-12
JP2000345113A2000-12-12
JP2014019715A2014-02-03
Attorney, Agent or Firm:
MAEDA & SUZUKI (JP)
Maeda and a Suzuki international patent business corporation (JP)
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