Title:
HOLDING PAD
Document Type and Number:
WIPO Patent Application WO/2016/038752
Kind Code:
A1
Abstract:
The present invention relates to a holding pad for holding a member to be polished. A holding pad according to the present invention comprises a holding layer. This holding pad is characterized in that: the holding layer has a template fixation part on a part of the surface, to said template fixation part a template for preventing horizontal displacement of a member to be polished being bonded; the template fixation part has an adsorption layer on the surface, said adsorption layer being used for the purpose of fixing the template by adsorption; and the adsorption layer is formed from a composition that is obtained by crosslinking a silicone that is formed of a specific siloxane. This holding pad is capable of firmly fixing a template during a polishing work, while having the template in a removable state.
Inventors:
YAJIMA TOSHIYASU (JP)
NINOMIYA DAISUKE (JP)
NINOMIYA DAISUKE (JP)
Application Number:
PCT/JP2014/081204
Publication Date:
March 17, 2016
Filing Date:
November 26, 2014
Export Citation:
Assignee:
MARUISHI SANGYO CO LTD (JP)
International Classes:
B24B37/30
Foreign References:
| JP2014108485A | 2014-06-12 | |||
| JP2011000670A | 2011-01-06 | |||
| JP2000212524A | 2000-08-02 | |||
| JP2004200451A | 2004-07-15 | |||
| JP2002059362A | 2002-02-26 |
Attorney, Agent or Firm:
TANAKA AND OKAZAKI (JP)
Patent business corporation Tanaka and Okazaki and associates (JP)
Patent business corporation Tanaka and Okazaki and associates (JP)
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