Title:
HOLLOW ELECTRONIC DEVICE SEALING SHEET AND PRODUCTION METHOD FOR HOLLOW ELECTRONIC DEVICE PACKAGE
Document Type and Number:
WIPO Patent Application WO/2014/156777
Kind Code:
A1
Abstract:
A hollow electronic device sealing sheet in which the hollow electronic device sealing sheet is immersed in 50 ml of deionized water, and in which at least one from among the chloride ion concentration, sodium ion concentration, phosphate ion concentration, and sulfate ion concentration in the deionized water after allowing to stand for 20 hours at 121°C and 2 atm is less than a given value.
Inventors:
TOYODA EIJI (JP)
SHIMIZU YUSAKU (JP)
SUNAHARA HAJIME (JP)
SHIMIZU YUSAKU (JP)
SUNAHARA HAJIME (JP)
Application Number:
PCT/JP2014/057171
Publication Date:
October 02, 2014
Filing Date:
March 17, 2014
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
H01L23/08; C09K3/10; H01L23/29; H01L23/31; H03H3/08; H03H9/25
Foreign References:
| JP2003313399A | 2003-11-06 | |||
| JP2011219726A | 2011-11-04 | |||
| JPH05251590A | 1993-09-28 | |||
| JP2007224167A | 2007-09-06 |
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (JP)
Patent business corporation ユニアス international patent firm (JP)
Patent business corporation ユニアス international patent firm (JP)
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