Title:
HOLLOW PACKAGE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2020/137610
Kind Code:
A1
Abstract:
A hollow package (103) includes a substrate (109), an element (111), a partition wall (113), and a top plate (115) and has one or more closed hollow parts (117) that are covered by the substrate (109), the partition wall (113), and the top plate (115), and the substrate (109), the partition wall (113), and the top plate (115) are sealed with a cured product of a sealing resin composition. The top plate (115) and the partition wall (113) are composed of an organic material, and the thickness of the top plate (115), the thickness of the partition wall (113), the width of the partition wall, and the maximum width of the hollow part (117) are each within respective predetermined ranges. The sealing resin composition comprises (A) an epoxy resin that includes one or more selected from the group consisting of an epoxy resin containing two epoxy groups in the molecule and an epoxy resin containing three or more epoxy resins in the molecule and (B) an inorganic filler.
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Inventors:
NAITO TADASHI (JP)
HONDA NAO (JP)
HAKONE YOSHIHIRO (JP)
OSHIDA HIROKI (JP)
SUNADA MAMORU (JP)
HONDA NAO (JP)
HAKONE YOSHIHIRO (JP)
OSHIDA HIROKI (JP)
SUNADA MAMORU (JP)
Application Number:
PCT/JP2019/048907
Publication Date:
July 02, 2020
Filing Date:
December 13, 2019
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
NIPPON KAYAKU KK (JP)
TOWA CORP (JP)
NIPPON KAYAKU KK (JP)
TOWA CORP (JP)
International Classes:
H01L23/08; G03F7/004; G03F7/038; H01L23/29; H01L23/31
Domestic Patent References:
| WO2012176750A1 | 2012-12-27 |
Foreign References:
| JP2012209817A | 2012-10-25 | |||
| JP2017171873A | 2017-09-28 |
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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