Title:
HOLLOW PARTICLE, METHOD FOR PRODUCING HOLLOW PARTICLE, RESIN COMPOSITION, AND MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2023/074651
Kind Code:
A1
Abstract:
Provided are: a hollow particle which exhibits good dielectric properties and solvent resistance and which can lower the dielectric constant and dielectric loss tangent of a resin molded body; and a method for producing the hollow particle. The hollow particle comprises a shell that contains a resin and a hollow part that is surrounded by the shell and which has a porosity of 50% or more. The shell contains a polymer containing 70 mass% or more of crosslinkable hydrocarbon monomer units as the resin. In a hollow particle immersion test, when adding 0.1 mg of hollow particles to 4 mL of toluene in an environment at 25°C, shaking the same for 10 minutes at a shaking speed of 100 rpm and then leaving to rest for 48 hours, the amount of hollow particles that sediment in the toluene is less than 5 mass%.
Inventors:
YAGYU SAKYO (JP)
Application Number:
PCT/JP2022/039609
Publication Date:
May 04, 2023
Filing Date:
October 25, 2022
Export Citation:
Assignee:
ZEON CORP (JP)
International Classes:
C08F212/36; B01J13/14; C08F2/18; C08F2/44
Domestic Patent References:
WO2021112110A1 | 2021-06-10 | |||
WO2021112117A1 | 2021-06-10 | |||
WO2012014279A1 | 2012-02-02 | |||
WO2021085189A1 | 2021-05-06 |
Foreign References:
CN105801898A | 2016-07-27 | |||
US20210009816A1 | 2021-01-14 | |||
JP2010149024A | 2010-07-08 |
Other References:
"Kagaku Binran, Kiso Hen, Kaitei 4 Ban", 30 September 1993, MARUZEN PUBLISHING CO., LTD., pages: 498 - 503
Attorney, Agent or Firm:
KISHIMOTO, Tatsuhito et al. (JP)
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