Title:
HOLLOW PARTICLES, PRODUCTION METHOD THEREFOR, AND USE OF HOLLOW PARTICLES
Document Type and Number:
WIPO Patent Application WO/2022/202046
Kind Code:
A1
Abstract:
Provided are hollow particles that provide an excellent reduction in the dielectric constant and dielectric loss tangent of a layered material (insulation layer) that contains the hollow particles, that exhibit an excellent strengthening of the adhesive strength for metal foil in an insulation layer, and that exhibit an excellent strengthening of fibrous material/resin interfacial adhesiveness. Hollow particles are used that have an average particle diameter of 0.010-1 μm and that have a shell comprising either of the following: (i) a polymer or copolymer of monomer having an aromatic ring and a plurality of reactive groups, and (ii) a copolymer of monomer having an aromatic ring and a plurality of reactive groups and monomer having an aromatic ring and one reactive group.
Inventors:
FURUTA TAKEFUMI (JP)
FURUKAWA YOSHIO (JP)
FURUKAWA YOSHIO (JP)
Application Number:
PCT/JP2022/007089
Publication Date:
September 29, 2022
Filing Date:
February 22, 2022
Export Citation:
Assignee:
KANEKA CORP (JP)
International Classes:
C08F12/34; B01J13/14; B32B15/08; C08L55/04; C08L71/12; H05K1/03
Domestic Patent References:
| WO2004067638A1 | 2004-08-12 |
Foreign References:
| JP2019114312A | 2019-07-11 | |||
| JP2006008750A | 2006-01-12 | |||
| JP2008031409A | 2008-02-14 |
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (JP)
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