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Title:
HOLLOW PARTICLES AND PRODUCTION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2023/189800
Kind Code:
A1
Abstract:
Provided are hollow particles having an excellent balance of pressure resistance, dielectric properties, and a thermal expansion coefficient as a filler for electronic material applications. The hollow particles each comprising a shell and a hollow portion surrounded by the shell has a porosity of 50% or more, and a volume average particle diameter of 1.0-50.0 μm, wherein the shell contains an organic-inorganic composite material containing a resin and inorganic fine particles, and the content of the inorganic fine particles in the shell is 20-90 mass%.

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Inventors:
CHIBA TAKERU (JP)
YAGYU SAKYO (JP)
Application Number:
PCT/JP2023/010816
Publication Date:
October 05, 2023
Filing Date:
March 20, 2023
Export Citation:
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Assignee:
ZEON CORP (JP)
International Classes:
C08F2/44; C08F292/00; C08K3/013; C08L101/00
Domestic Patent References:
WO2022025123A12022-02-03
WO2019189692A12019-10-03
WO2022059625A12022-03-24
WO2020066705A12020-04-02
Foreign References:
JP2010155909A2010-07-15
US20100159231A12010-06-24
JP2007048615A2007-02-22
CN103962074A2014-08-06
JP2021191639A2021-12-16
JPH10158526A1998-06-16
JP2012007056A2012-01-12
JP2004087639A2004-03-18
JP2008031409A2008-02-14
JP2021134261A2021-09-13
Attorney, Agent or Firm:
KISHIMOTO, Tatsuhito et al. (JP)
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