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Title:
HOLLOW PARTICLES AND USE THEREOF
Document Type and Number:
WIPO Patent Application WO/2022/202784
Kind Code:
A1
Abstract:
Hollow particles are provided which can suppress the occurrence of pinholes in the shell and which can prevent crushing of the hollow part due to deformation. Specifically, in these hollow particles, which comprise a shell and a hollow part enclosed by the shell, the shell contains a (meth)acrylic resin, the average particle diameter of the hollow particles is 10-150 nm, the sphericity of the hollow particles is 0.90-1.0, and the hollow ratio of the hollow particles is 35%-70%.

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Inventors:
KATAYAMA YUGO (JP)
Application Number:
PCT/JP2022/013070
Publication Date:
September 29, 2022
Filing Date:
March 22, 2022
Export Citation:
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Assignee:
SEKISUI KASEI CO LTD (JP)
International Classes:
C09D201/00; B01J13/16; C09D7/65
Domestic Patent References:
WO2019177006A12019-09-19
Foreign References:
JP2006089648A2006-04-06
JP2009035672A2009-02-19
JP2017226786A2017-12-28
JP2007216676A2007-08-30
Attorney, Agent or Firm:
SAEGUSA & PARTNERS (JP)
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