HOLLOW RESIN CASE FOR HOUSING SEMICONDUCTOR CHIP

WIPO Patent Application WO/2012/111642

A1

A hollow resin case for housing a semiconductor chip, which is composed of: a hexahedral container part that has a cavity for housing a semiconductor chip and is formed from a resin composition that contains a filler and a liquid crystal polyester which contains repeating units respectively represented by formulae (1), (2) and (3) below and which contains, when the total amount of the repeating units (1), (2) and (3) is taken as 100% by mole, 40-75% by mole of a repeating unit that contains a 2,6-naphthylene group; and a rectangular plate-like cover part for sealing the cavity-side surface of the container part. The container part and the cover part are hermetically sealed by sealing after a semiconductor chip is housed in the cavity. (1) -O-Ar1-CO- (2) -CO-Ar2-CO- (3) -O-Ar3-O- In the formulae, Ar1 represents a 2,6-naphthylene group, a 1,4-phenylene group or a 4,4'-biphenylylene group; Ar2 and Ar3 each independently represents a 2,6-naphthylene group, a 1,4-phenylene group, a 1,3-phenylene group or a 4,4'-biphenylylene group; and each of the hydrogen atoms in the groups respectively represented by Ar1, Ar2 and Ar3 may independently be substituted by a halogen atom, an alkyl group or an aryl group.

SAKA YUICHI (JP)
MAEDA MITSUO (JP)
SUZUKI HISASHI (JP)

PCT/JP2012/053327

August 23, 2012

February 14, 2012

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SUMITOMO CHEMICAL CO (JP)
SAKA YUICHI (JP)
MAEDA MITSUO (JP)
SUZUKI HISASHI (JP)

C08L67/00; C08G63/60; H01L23/08

JPH07321251A	1995-12-08
JP2007324847A	2007-12-13
JP2007154169A	2007-06-21
JPH07278282A	1995-10-24
JP2006261654A	2006-09-28
JP2009260280A	2009-11-05
JP2009088335A	2009-04-23

SAMEJIMA, Mutsumi et al. (JP)
Mutsumi Sameshima (JP)

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