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Patent Searching and Data


Title:
HOLLOW RESIN PARTICLES, METHOD FOR PRODUCING HOLLOW RESIN PARTICLES, AND USE OF HOLLOW RESIN PARTICLES
Document Type and Number:
WIPO Patent Application WO/2022/131127
Kind Code:
A1
Abstract:
Provided are hollow resin particles having a shell part and a hollow portion surrounded by the shell part, the hollow resin particles being capable of achieving dielectric lowering and dielectric loss tangent lowering and realizing excellent heat resistance. Also provided is a method for producing this type of hollow resin particle in a simple manner. Further provided is the use of this type of hollow resin particle. The hollow resin particles according to an embodiment of the present invention are hollow resin particles having a shell part and a hollow portion surrounded by the shell part, the shell part having an ether structure represented by formula (1).

Inventors:
MATSUURA HARUHIKO (JP)
MATSUNO SHINYA (JP)
Application Number:
PCT/JP2021/045347
Publication Date:
June 23, 2022
Filing Date:
December 09, 2021
Export Citation:
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Assignee:
SEKISUI KASEI CO LTD (JP)
International Classes:
C08F12/34; C08F2/44; C08F12/36; C08F20/20
Domestic Patent References:
WO2014203511A12014-12-24
Foreign References:
JP2017160399A2017-09-14
JPS6465140A1989-03-10
JP2014529672A2014-11-13
JPH0213273B21990-04-03
JP4445495B22010-04-07
JP2002080503A2002-03-19
JP2000313818A2000-11-14
JP4171489B22008-10-22
JP2001139663A2001-05-22
Other References:
OYO BUTURI, DIELECTRIC CONSTANT OF MIXED SYSTEMS, vol. 27, 1958
Attorney, Agent or Firm:
MOMII Takafumi (JP)
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