Title:
HOLLOW RESIN PARTICLES USED IN RESIN COMPOSITION FOR SEMICONDUCTOR MEMBER
Document Type and Number:
WIPO Patent Application WO/2022/131022
Kind Code:
A1
Abstract:
Provided are hollow resin particles used in a resin composition for a semiconductor member with which it is possible to provide a semiconductor member capable of manifesting excellent low dielectric properties when used in a resin composition for a semiconductor member. The hollow resin particles used in a resin composition for a semiconductor member according to an embodiment of the present invention are hollow resin particles having a void portion inside the particle, the reduction rate of the relative permittivity Dk1 of a film (F1) in which 80 wt parts of polyimide are blended with 20 wt parts of the hollow resin particles to the relative permittivity Dk0 of a film (F0) composed of only the polyimide being 3% or more.
Inventors:
HARADA RYOSUKE (JP)
OKAMOTO KOICHIRO (JP)
OKAMOTO KOICHIRO (JP)
Application Number:
PCT/JP2021/044458
Publication Date:
June 23, 2022
Filing Date:
December 03, 2021
Export Citation:
Assignee:
SEKISUI KASEI CO LTD (JP)
International Classes:
C08F30/02; C08F2/18; C08F230/02; C08J9/32; H01B3/30; H01L21/312
Domestic Patent References:
| WO2020054816A1 | 2020-03-19 | |||
| WO1998050945A2 | 1998-11-12 |
Foreign References:
| JP2001294815A | 2001-10-23 | |||
| JP2000311518A | 2000-11-07 | |||
| JP2017525585A | 2017-09-07 | |||
| JPH02113984A | 1990-04-26 | |||
| JP2017082152A | 2017-05-18 |
Attorney, Agent or Firm:
MOMII Takafumi (JP)
Download PDF:
Previous Patent: ELECTROLYTIC CAPACITOR AND METHOD FOR MANUFACTURING ELECTROLYTIC CAPACITOR
Next Patent: MOTOR CONTROL DEVICE AND MOTOR CONTROL SYSTEM
Next Patent: MOTOR CONTROL DEVICE AND MOTOR CONTROL SYSTEM