Title:
HOLLOW-SPACE-SEALING RESIN SHEET AND METHOD FOR MANUFACTURING HOLLOW PACKAGE
Document Type and Number:
WIPO Patent Application WO/2015/079871
Kind Code:
A1
Abstract:
This hollow-space-sealing resin sheet contains an inorganic filler in an amount greater than or equal to 62% by volume, and the particle-size distribution of said inorganic filler is such that the percentage of particles constituting said inorganic filler that are larger than the width of the hollow part of a hollow package to be manufactured is less than 10% by volume. If said hollow-space-sealing resin sheet is laid out on top of a test substrate that has a plurality of flip chips connected thereto and a pressure of 1 kgf/cm2 is applied at a temperature of 70°C in a 10 Torr vacuum from the side where the hollow-space-sealing resin sheet is, the ratio (A/B) between the penetration rate (A) of the material constituting the hollow-space-sealing resin sheet between the chips and the penetration rate (B) of said material into gaps is greater than or equal to 5.
Inventors:
TOYODA EIJI (JP)
SHIMIZU YUSAKU (JP)
HABU TAKASHI (JP)
ICHIKAWA TOMOAKI (JP)
SHIMIZU YUSAKU (JP)
HABU TAKASHI (JP)
ICHIKAWA TOMOAKI (JP)
Application Number:
PCT/JP2014/079221
Publication Date:
June 04, 2015
Filing Date:
November 04, 2014
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
H01L23/08; H01L21/60; H01L23/29; H01L23/31; H03H3/08; H03H9/25
Foreign References:
| JP2006321216A | 2006-11-30 | |||
| JP2005060584A | 2005-03-10 | |||
| JP2006241449A | 2006-09-14 | |||
| JP2008098419A | 2008-04-24 |
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (JP)
Patent business corporation ユニアス international patent firm (JP)
Patent business corporation ユニアス international patent firm (JP)
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