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Patent Searching and Data


Title:
HOT DIFFUSION WELDING
Document Type and Number:
WIPO Patent Application WO/1992/001528
Kind Code:
A1
Abstract:
A first member of copper alloy and a second member of another matrial are joined with an insert between them by hot diffusion welding with heat and pressure. The insert material is a copper plating formed on the joining surface of the second member to be joined, whereby the thermal conductivity on the joining surfaces between the two members is improved to effect electric resistance heating smoothly, so that continuous working is made possible without polishing for removing oxide from the electrically conductive surface of a pair of electrodes. Furthermore, when the insert material interposed between the joining surfaces of the both members as described above is of a normal brazing material, an even number of superposed bodies, each consisting of a first member, an insert material and a second member to be joined, are superposed on one another in such a manner that the respective first members are brought into abutting contact with each other, and subjected to electric resistance heating. In this case, the second member having a high thermal capacity is abutted against the pair of electrodes, whereby there is no need for polishing to remove oxide from the electric conductive surfaces of the pair of electrodes, so that the continuous working is made possible by hot diffusion welding method according to the present invention.

Inventors:
INOUE SHINICHIRO (JP)
Application Number:
PCT/JP1991/000976
Publication Date:
February 06, 1992
Filing Date:
July 23, 1991
Export Citation:
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Assignee:
KOMATSU MFG CO LTD (JP)
International Classes:
B23K20/02; B23K35/00; (IPC1-7): B23K20/00
Foreign References:
JPS52103359A1977-08-30
JPS5924592A1984-02-08
JPS574433B21982-01-26
JPS5897485A1983-06-09
JPS6453763A1989-03-01
Other References:
See also references of EP 0550749A4
Attorney, Agent or Firm:
Sugiura, Toshiki (10-24 Shinmachi 1-chome, Nishi-k, Osaka-shi Osaka 550, JP)
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