Title:
HOT-MELT ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2013/133407
Kind Code:
A1
Abstract:
Provided is a hot-melt adhesive composition containing: (A) an ethylene copolymer obtained by copolymerizing ethylene and an α-olefin using a single-site catalyst; and (B) a rosin ester, in which in a hydrolysate thereof, the dehydroabietic acid content does not exceed 30wt%, the abietic acid content does not exceed 10wt%, and in a methylated product of the hydrolysate, the content of components having a molecular weight of 320 is at least 10% of the total of components having a molecular weight of 314 to 320.
Inventors:
NAKATANI TAKASHI (JP)
Application Number:
PCT/JP2013/056435
Publication Date:
September 12, 2013
Filing Date:
March 08, 2013
Export Citation:
Assignee:
ARAKAWA CHEM IND (JP)
International Classes:
C09J123/08; C09J193/04
Foreign References:
| JP2000507283A | 2000-06-13 | |||
| JP2000034447A | 2000-02-02 | |||
| JPH083525A | 1996-01-09 | |||
| JPH061964A | 1994-01-11 | |||
| JP2011524919A | 2011-09-08 | |||
| JPS55106277A | 1980-08-14 | |||
| JPS58220737A | 1983-12-22 | |||
| JP2000096015A | 2000-04-04 | |||
| JPH10147672A | 1998-06-02 |
Other References:
See also references of EP 2824154A4
Attorney, Agent or Firm:
MORITA, TOSHIAKI (JP)
Morita 隼明 (JP)
Morita 隼明 (JP)
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Claims: